We use cookies for the provision and functionality of this website. If you agree that we can use cookies for other purposes please click here. Information on deactivating cookies and data protection
Laserschneiden mit TRUMPF Produkten

Laserschneiden und Laserbohren

The laser easily handles the most diverse of cutting tasks. These range from cutting gaps to the micrometer in wafer-thin semiconductor chips up to the high quality cutting of 30-millimeter steel plate. With laser drilling, the laser beam can cut the finest of holes in metal, plastics, paper and stone.

Service & contact


Country and language selection

Please note

You have selected China. Based on your configuration, United States might be more appropriate. Do you want to keep or change the selection?

United States

Or select a country or region.