We use cookies for this website. If you continue to use this website without changing the settings for cookies, we assume that you agree to the use of cookies.
Laserschneiden mit TRUMPF Produkten

Laserschneiden und Laserbohren

The laser easily handles the most diverse of cutting tasks. These range from cutting gaps to the micrometer in wafer-thin semiconductor chips up to the high quality cutting of 30-millimeter steel plate. With laser drilling, the laser beam can cut the finest of holes in metal, plastics, paper and stone.

Service & contact