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Passive sputtering (PVD method)

Atomise to recreate

Ideal für Großflächenbeschichtung

PVD technology (Physical Vapour Deposition) is used to apply thin films measuring just micrometres to materials of various qualities. To do so, a block of material, consisting of the film material to be applied, is evaporated in a vacuum. This creates a gas mixture of atomic particles, which precipitate onto the substrate. In plasma-assisted PVD processes, a cathode is evaporated by being bombarded with ions. This sputter or evaporation process can take place at room temperature. It is divided into three stages: Sputtering, diffusion, and film growth.

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Dr. Jan Peter Engelstädter
Plasma MF
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Contact

Dr. Daniel Krausse
Plasma RF
E-mail
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