Beam sources based on VCSEL arrays are able to heat large surfaces with directed wavelength-selective infrared radiation. These VCSEL heating systems are used in numerous industrial heating processes. Due to direct irradiation of the treatment surface, significant cost benefits can be achieved compared to conventional laser systems, without expensive optics or scanner systems. The unique thing about the systems is that, in addition to the precise control and fast switch-over of the infrared output, the spatial heating profile can also be programmed as needed through independent control of small segments of the laser modules. The heating patterns can even change dynamically during operation. This enables unparalleled process flexibility
Benefit from a scalable output power in the kW range.
Achieve a high process speed with irradiance of 100 W/cm².
Individual emission zones of the VCSEL beam source can be controlled independently of one another.
The robust and compact laser modules can be integrated easily into industrial systems and production processes.
Benefit from quick welding of large plastic parts thanks to high irradiance in the homogenously irradiated heating zone. Integration is very easy due to the small dimensions of the module.
VSCEL heating modules make it quick and easy to selectively soften high-tensile steel parts. This has many benefits, particularly in automotive production.
The active material on the electrode foil must be dried after the recoating process. Industrial VCSEL heating systems can perform this step, because beam sources based on VCSEL arrays are able to heat large surfaces with directed wavelength-selective infrared radiation.
Using VCSEL heating systems to seal pouch cells increases the quality of the sealing results. In addition, the process time is reduced. The process is up to three times faster in comparison.
VCSEL lasers can be used in the semiconductor industry for heating the wafers for Rapid Thermal Processing (RTP). VCSEL heating modules make it possible to heat the wafers quickly and uniformly as the individual heat zones can be superbly controlled. Temperature increases of several hundred degrees Celsius can be achieved per second.
In so-called selective laser sintering (SLS), a focused laser beam melts plastic powder locally, thereby generating the component. This is made possible by the highly innovative VCSEL heating system from TRUMPF, which contains over 3,000 individually controllable lasers (VCSEL arrays). The production speed is thus increased by a factor of 10 compared to conventional 3D printing machines, in which one or two lasers scan the construction area. In particular, applications in plastic injection moulding can be implemented with high productivity using this technology.
VCSEL heating systems open up numerous benefits in solar cell production. For example, during the process of selective burning-in of the contacts on the solar cell. There are benefits for regeneration processes as well: the intensive irradiation of the cell decreases defects and removes energy barriers, therefore increasing efficiency.
Using solder balls, a flip chip is positioned as a connecting element on a printed circuit board in Laser Assisted Bonding (LAB). The VCSEL heating system irradiates the chip from above and the laser energy is transferred by a silicon chip in order to melt the solder balls between the chip and the printed circuit board. Compared to other solutions, the VCSEL heating systems provide larger heating surfaces with higher performance options.
In Laser Assisted Soldering (LAS), the solder balls are connected directly with the soldering pads on the printed circuit board using VCSEL infrared heat treatment. This is particularly interesting if smaller solder ball and pitches are used. The VCSEL heating system technology offers highly precise heating and top solder joint quality. The LAS process also helps to increase the service life of printed circuit boards.
In so-called selective laser sintering (SLS), a focused laser beam melts plastic powder locally, thereby generating the component. This is made possible by the highly innovative VCSEL heating system from TRUMPF, which contains over 3,000 individually controllable lasers (VCSEL arrays). The production speed is thus increased by a factor of 10 compared to conventional 3D printing machines, in which one or two lasers scan the construction area. In particular, applications in plastic injection moulding can be implemented with high productivity using this technology.
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PPM412-12-980-24
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PPM412-24-980-48
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PPM412-48-980-96
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PPM412-96-980-192
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PPM415-32-980-64
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PPM417-10-980-20
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PPM419-30-980-60
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PPM420-24-980-48
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| Laser parameters | ||||||||
| Wavelength | 980 nm | 980 nm | 980 nm | 980 nm | 980 nm | 980 nm | 980 nm | 980 +/- 20 nm |
| Laser power | 2.4 kW | 4.8 kW | 9.6 kW | 19.2 kW | 6.4 kW | 2 kW | 6 kW | 4.8 kW |
| Beam angle | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | - | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) |
| Number of zones | 12 pieces | 24 pieces | 48 pieces | 96 pieces | 96 pieces | 10 pieces | 30 pieces | 24 pieces |
| Emission range | 40 x 52 mm2 | 40 x 104 mm2 | 40 x 208 mm2 | 417.5 x 38 mm2 | 199.1 x 38 mm2 | 47 x 26 mm2 | 521.6 x 25.3 mm2 | zweimal 40 x 52 mm2 |
| Irradiance | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 140 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 |
| Laser class | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Optics | ||||||||
| Optical element | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | 26 mm mirror concentrator | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics |
| Protective glass |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
| Size | ||||||||
| Width dimension | 87 mm | 87 mm | 87 mm | 112.7 mm | 93 mm | 49 mm | 133.5 mm | 166 mm |
| Height dimension | 48 mm | 48 mm | 48 mm | 113 mm | 100 mm | 133 mm | 87 mm | 71 mm |
| Depth dimension | 108 mm | 160 mm | 264 mm | 563 mm | 319 mm | 270 mm | 652 mm | 254 mm |
| Driver unit | ||||||||
| Number of driver units | 1 pieces | 2 pieces | 4 pieces | 1 pieces | 1 pieces | 1 pieces | 1 pieces | 2 pieces |
| Laser control | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser zone monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser zone monitoring |
| Machine interface | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) |
| Power supply | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz |
| Installation | ||||||||
| Ambient temperature | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C |
| Humidity (max.) | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C |
| Chiller | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required |
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PPM412-12-980-24
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PPM412-24-980-48
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PPM412-48-980-96
|
PPM412-96-980-192
|
PPM415-32-980-64
|
PPM417-10-980-20
|
PPM419-30-980-60
|
PPM420-24-980-48
|
|
|---|---|---|---|---|---|---|---|---|
| Laser parameters | ||||||||
| Wavelength | 980 nm | 980 nm | 980 nm | 980 nm | 980 nm | 980 nm | 980 nm | 980 +/- 20 nm |
| Laser power | 2.4 kW | 4.8 kW | 9.6 kW | 19.2 kW | 6.4 kW | 2 kW | 6 kW | 4.8 kW |
| Beam angle | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) | - | Typically with 10° (at 95% power) | Typically with 10° (at 95% power) |
| Number of zones | 12 pieces | 24 pieces | 48 pieces | 96 pieces | 96 pieces | 10 pieces | 30 pieces | 24 pieces |
| Emission range | 40 x 52 mm2 | 40 x 104 mm2 | 40 x 208 mm2 | 417.5 x 38 mm2 | 199.1 x 38 mm2 | 47 x 26 mm2 | 521.6 x 25.3 mm2 | zweimal 40 x 52 mm2 |
| Irradiance | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 | typisch 140 W/cm2 | typisch 115 W/cm2 | typisch 115 W/cm2 |
| Laser class | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Optics | ||||||||
| Optical element | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics | 26 mm mirror concentrator | Optionally with focusing or scattering optics | Optionally with focusing or scattering optics |
| Protective glass |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
Double safety glass, anti-reflective coated |
| Size | ||||||||
| Width dimension | 87 mm | 87 mm | 87 mm | 112.7 mm | 93 mm | 49 mm | 133.5 mm | 166 mm |
| Height dimension | 48 mm | 48 mm | 48 mm | 113 mm | 100 mm | 133 mm | 87 mm | 71 mm |
| Depth dimension | 108 mm | 160 mm | 264 mm | 563 mm | 319 mm | 270 mm | 652 mm | 254 mm |
| Driver unit | ||||||||
| Number of driver units | 1 pieces | 2 pieces | 4 pieces | 1 pieces | 1 pieces | 1 pieces | 1 pieces | 2 pieces |
| Laser control | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser zone monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser monitoring | Typically with 10 ms time constant; individual control of laser emission zones; integrated laser zone monitoring |
| Machine interface | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) | Ethernet-based (EtherCAT® protocol) |
| Power supply | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz | 400V (±10%) between 3 phases, 47-63 Hz |
| Installation | ||||||||
| Ambient temperature | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C | 5 - 40 °C |
| Humidity (max.) | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C | Non-condensing for cooling water temperature of 20 °C |
| Chiller | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required | Cooling device with water-water or water-air heat exchanger required |
The technical data of all product versions as a download.
The 2.4 kW VCSEL heating module is the smallest standard module. Like all modules, it has great cost benefits as the beam is directed straight at the application area without the additional use of optics or a scanner system.
The 4.8 kW VCSEL heating module is a standard module which is suitable for directed, large-area heating applications.
The 9.6 kW VCSEL heating module is a standard module which is also used for directed, large-area heating applications.
This standard VCSEL heating system is the basis for numerous product variants as it can be adapted flexibly to customer requests. The width and therefore emitting area can be extended easily. The infrared output power can be up to several tens of kilowatts.
The VCSEL heating systems can be easily adapted to customised requirements. Depending on the customer application, the correct configuration of VCSEL heating system is determined together.
The 2.0 kW VCSEL heating module contains concentrating optics to divert the laser radiation to the joint gap in a targeted manner. This module is particularly suitable for applications in composite manufacturing.
This VCSEL module has a relatively low irradiance with a large width. This is why it is especially suitable for drying battery foils. Several modules can be arranged one after the other to create a longer drying path.
The VCSEL module satisfies the specific requirements for the manufacture of furniture with welded and seamless edges to outstanding quality standards. This compact VCSEL laser source has horizontal zoning for varying edge heights. It is also particularly flat so that it is possible to get very close to the joining process.
Compact laser module with 32 VCSEL arrays and focusing optics. Each VCSEL array can be controlled individually and has an output power of 2 W. The driver electronics placed near the VCSEL enable very fast switching (< 5 µs). With the corresponding optics, printing applications with a resolution of up to 250 dpi and a power density of up to 10^4 W/cm2 can be supported, such as 3D printing of plastics or marking of packaging material.
Control software for VCSEL heating systems
The basic version of the control software offers the function of manually controlling the laser channels of the VCSEL heating system and of setting the power.
The extended control software version is based on the basic version and offers additional functions such as temperature control or pulsing. In addition, time and performance profiles can be created. These can be used to vary the power of the VCSEL heating system during the processing time.
The heat density of VCSEL heating systems can be influenced with additional lenses. The irradiance of VCSEL modules can be increased with positive lenses. The use of negative lenses decreases the irradiance of the modules.
The Air Knife can be used to keep spatter and steam away from the protective glass of the laser system. It creates a protective airflow in front of the laser.
Mounting brackets simplify the technical assembly of the VCSEL heating module.
A VCSEL heating module with less tightly packed emitters and a defocusing lens can be used for applications requiring less irradiance.
This product range and information may vary depending on the country. Subject to changes to technology, equipment, price and range of accessories. Please get in touch with your local contact person to find out whether the product is available in your country.
