We use cookies for the provision and functionality of this website. If you agree that we can use cookies for other purposes please click here. Information on deactivating cookies and data protection


Quick Thin Film Deposition


Thin films can be applied to materials of varying qualities by using CVD technology (Chemical Vapor Deposition). Here, a solid film is created from gaseous materials and is deposited as a crystal or amorphous film on the material (substrate) to be coated. In traditional CVD coating processes, the process gas breaks up into its reaction products only on the heated substrate.

In plasma enhanced CVD (PECVD) processes, however, the gas molecules dissociate themselves under the influence of the plasma. They then react toward the film material and deposit themselves on the substrate. The coating process is faster with a higher utilization of the process gas.

PECVD operates at substantially lower temperatures than CVD without plasma. In PECVD processes, the temperatures may be below 500°C, which protects the substrate materials to be coated.


Dr. Daniel Krausse
Plasma RF
Dr. Jan Peter Engelstädter
Plasma MF
Service & contact


Country and language selection

Please note

You have selected the international "English" language version of the website. Based on your configuration, United States might be more appropriate. Do you want to keep or change the selection?

International English
United States

Or select a country or region.