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Program

24.09.2019: Digital transformation, glass coating and semiconductor

08:00 - 09:00

Conference registration

 
09:00 - 09:30

Welcome – start of the conference

 
 

Session 1 – Digital transformation

 
09:30 - 09:55

Digitalization and computational engineering for plasma coaters

Prof. Dr.-Ing. Christoph Herrmann, Fraunhofer IST, DE

09:55 - 10:00

Motto stop

 
10:00 - 10:20

IoT services – connected benefits for MF power supplies

Dr. Jan-Peter Engelstädter, TRUMPF Hüttinger, DE

10:20 - 10:40

Digitalization of industrial vacuum coating – automated process control & data analysis

Dr. Frank Benecke, Von Ardenne, DE

10:40 - 11:00

Get together: Time2Network

 
 

Session 2 – Challenges and opportunities in glass coating

 
11:00 - 11:25

Metallic glass coatings with beneficial properties by HiPIMS: a comparison study

Prof. Jinn P. Chu, National Taiwan University, TW

11:25 - 11:30

Motto stop

 
11:30 - 11:50

High-quality glass processing by means of ultrashort pulsed lasers

Dr. Marcel Schäfer, TRUMPF, DE

11:50 - 12:10

Low-temperature deposition of high-performance thermochromic VO2-based coatings for energy saving windows

Prof. Jaroslav Vlcek, University of West Bohemia, CZ

12:10 - 12:30

Dual magnetron sputtering – sputter rate and efficiency

Dr. Moritz Heintze, TRUMPF Hüttinger, DE

12:30 - 13:30

Lunch break

 
 

Session 3 – Symposium spotlight:
Semiconductor manufacturing – part 1

 
13:30 - 13:55

Technical features of next generation plasma enhanced atomic layer deposition (PEALD)

Sang Jean (Greg) Jeon, ASMK, KR

13:55 - 14:00

Motto stop

 
14:00 - 14:20

Etch process technologies

NN, Samsung Electronic, KR

14:20 - 14:40

Technical trends of plasma etching equipment

Dr. Kazuya Nagaseki, Tokyo Electron, JP

14:40 - 15:00

Get together: Time2Network

 
 

Session 3 – Symposium spotlight:
Semiconductor manufacturing – part 2

 
15:00 - 15:20

Trends in contemporary semiconductor film deposition technology

Seung Moo Lee, Samsung Electronic, KR

15:20 - 15:40

Reactively sputtered high-k dielectric films for electronic and photonic applications

Prof. Robert Mroczynski, Warsaw University of Technology, PL

15:40 - 16:00

High power dual frequency systems for next generation display applications – advantages, opportunities and challenges

Tonatiuh Rivera Toral, TRUMPF Hüttinger, DE

16:00 - 16:20

Quality @ TRUMPF

Dr. Bartlomiej Bonarski, TRUMPF Hüttinger, PL

16:20 - 16:40

Summary day 1

 
18:00

Evening event

 

25.09.2019: Industrial coating, advanced applications and energy harvesting

08:50 - 09:00

Welcome – start of the conference

 
 

Session 4 –
Industrial coating & advanced applications – part 1

 
09:00 - 09:25

Sputtering as key for innovations – some recent results from R+D

Prof. Dr. Günter Bräuer, Fraunhofer IST, DE

09:25 - 09:30

Motto stop

 
09:30 - 09:50

Carbon-based anti-corrosive conductive coatings for PEMFC bipolar plates

Dr. Roel Tietema, Hauzer, NL

09:50 - 10:10

Plasma nitriding at increased voltage

Dr. Peter Kaestner, Technical University of Braunschweig, DE

10:10 - 10:30

Graphene film grown on copper foil by using bipolar HIPIMS for thermal management

Prof. Ju-Liang He, Taiwan University, TW

10:30 - 11:00

Get together: Time2Network

 
 

Session 4 –
Industrial coating & advanced applications –
part 2

 
11:00 - 11:25

Coatings for aerospace

Prof. Jolanta Klemberg-Sapieha, Polytechnique Montréal, CN

11:25 - 11:30

Motto stop

 
11:30 - 11:50

Self-adjustment of the power supply for crazing elimination in large area coating

Krzysztof Ruda, TRUMPF Hüttinger, PL

11:50 - 12:10

Thin films of carbides and carbon-based nanocomposites

Prof. Witold Gulbinski, Koszalin University, PL

12:10 - 13:10

Lunch break

 
13:10 - 14:40

Group picture & company tour

 
14:40 - 15:40

Coffee @ poster session

 
 

Session 5 – Energy harvesting

 
15:40 - 16:05

New display technologies for new opportunities – new kinds of displays grow into multiple new markets

Klaus Wammes, Wammes & Partner, DE

16:05 - 16:30

Inductively coupled heating of pulsed plasmas

Joscha Schmidt, University Gießen, DE

16:30 - 16:50

Effect of HiPIMS pulse parameters on a reactive SiOx deposition process

Prof. Arutiun Ehiasarian, Sheffield Hallam University, UK

16:50 - 17:10

Latest developments in TOPCon PV cells

Dr.-Ing. Jochen Rentsch, Fraunhofer ISE, DE

17:10 - 17:30

Summary day 2

 
18:00

Evening reception

 
     
     
     
     
     

26.09.2019: Workshop: Modelling of process and application pit stops

08:50 - 09:00

Welcome, health and safety briefing

 
 

Session 6 – Modelling of deposition process – part 1

 
09:00 - 09:25

Modelling reactive magnetron sputtering: opportunities and challenges

Prof. Dr. Diederik Depla, Ghent University, B

09:25 - 09:45

Modelling of thin film deposition processes as a service

Dr. Andreas Pflug, Fraunhofer IST, DE

09:45 - 10:00

Get together: Time2Network

 
10:00 - 12:15

Application pit stop – part 1

Crazing prevention algorithm, HiPIMS – thinking positive, high power dual frequency systems

12:15 - 13:15

Lunch break

 
 

Session 6 – Modelling of deposition process – part 2

 
13:15 - 13:35

Efficient predictive simulation in thin film coating industry

Petr Zikan, PlasmaSolve, CZ

13:35 - 13:55

Application of design of experiment methods for power supply-related process parameters optimization

Dr Wojciech Gajewski, TRUMPF Hüttinger, PL

13:55 - 14:10

Get together: Time2Network

 
14:10 - 16:25

Application pit stop – part 2

IoT services – connected benefits, managing arcs, multifunctional synchronization

16:25 - 16:35

End of workshop

 

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