Titanium, silver, zinc, aluminum or silicon targets can be sputtered in a reactive sputtering process just as in passive sputtering. However, the atoms that form the film on the substrate come from both the target material and the gaseous stage.
Titanium, silver, zinc, aluminum or silicon targets can be sputtered in a reactive sputtering process just as in passive sputtering. However, the atoms that form the film on the substrate come from both the target material and the gaseous stage.
