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Power Electronics for Plasma Engineering Conference

Save the date: September 24th - 26th 
in Zielonka/Warsaw, Poland 

PE² 2019 - Generating Modern Life

10th Power Electronics for Plasma Engineering Conference will take place from  September 24th - 26th 2019 in Zielonka, Poland.

"Generating Modern Life" will be the theme of 10 years anniversary of the "Power Electronics for Plasma Engineering Conference" (PE²) and as in previous years, the PE² 2019 will consist of a multi-faceted program. Lectures on new applications in the field of plasma technology as well as product trends will inspire attendees and inform them on recent achievements in research and development.

Conference fees

Conference feesEarly BirdAfter August 1, 2019
PE²
(incl. Workshop)
350€500€
PE²
(excl. Workshop)
250€400€

Registration is open until September 10th

The conference language is English.

Program

24.09.2019: Digital transformation, glass coating and semiconductor

08:00 - 09:00

Conference registration

 
09:00 - 09:30

Welcome – start of the conference

 
 

Session 1 – Digital transformation

 
09:30 - 09:55

Digitalization and computational engineering for plasma coaters

Prof. Dr.-Ing. Christoph Herrmann, Fraunhofer IST, DE

09:55 - 10:00

Motto stop

 
10:00 - 10:20

IoT services – connected benefits for MF power supplies

Dr. Jan-Peter Engelstädter, TRUMPF Hüttinger, DE

10:20 - 10:40

Digitalization of industrial vacuum coating – automated process control & data analysis

Dr. Frank Benecke, Von Ardenne, DE

10:40 - 11:00

Get together: Time2Network

 
 

Session 2 – Challenges and opportunities in glass coating

 
11:00 - 11:25

Metallic glass coatings with beneficial properties by HiPIMS: a comparison study

Prof. Jinn P. Chu, National Taiwan University, TW

11:25 - 11:30

Motto stop

 
11:30 - 11:50

High-quality glass processing by means of ultrashort pulsed lasers

Dr. Marcel Schäfer, TRUMPF, DE

11:50 - 12:10

Low-temperature deposition of high-performance thermochromic VO2-based coatings for energy saving windows

Prof. Jaroslav Vlcek, University of West Bohemia, CZ

12:10 - 12:30

Dual magnetron sputtering – sputter rate and efficiency

Dr. Moritz Heintze, TRUMPF Hüttinger, DE

12:30 - 13:30

Lunch break

 
 

Session 3 – Symposium spotlight:
Semiconductor manufacturing – part 1

 
13:30 - 13:55

Technical features of next generation plasma enhanced atomic layer deposition (PEALD)

Sang Jean (Greg) Jeon, ASMK, KR

13:55 - 14:00

Motto stop

 
14:00 - 14:20

Etch process technologies

NN, Samsung Electronic, KR

14:20 - 14:40

Technical trends of plasma etching equipment

Dr. Kazuya Nagaseki, Tokyo Electron, JP

14:40 - 15:00

Get together: Time2Network

 
 

Session 3 – Symposium spotlight:
Semiconductor manufacturing – part 2

 
15:00 - 15:20

Trends in contemporary semiconductor film deposition technology

Seung Moo Lee, Samsung Electronic, KR

15:20 - 15:40

Reactively sputtered high-k dielectric films for electronic and photonic applications

Prof. Robert Mroczynski, Warsaw University of Technology, PL

15:40 - 16:00

High power dual frequency systems for next generation display applications – advantages, opportunities and challenges

Tonatiuh Rivera Toral, TRUMPF Hüttinger, DE

16:00 - 16:20

Quality @ TRUMPF

Dr. Bartlomiej Bonarski, TRUMPF Hüttinger, PL

16:20 - 16:40

Summary day 1

 
18:00

Evening event

 

25.09.2019: Industrial coating, advanced applications and energy harvesting

08:50 - 09:00

Welcome – start of the conference

 
 

Session 4 –
Industrial coating & advanced applications – part 1

 
09:00 - 09:25

Sputtering as key for innovations – some recent results from R+D

Prof. Dr. Günter Bräuer, Fraunhofer IST, DE

09:25 - 09:30

Motto stop

 
09:30 - 09:50

Carbon-based anti-corrosive conductive coatings for PEMFC bipolar plates

Dr. Roel Tietema, Hauzer, NL

09:50 - 10:10

Plasma nitriding at increased voltage

Dr. Peter Kaestner, Technical University of Braunschweig, DE

10:10 - 10:30

Graphene film grown on copper foil by using bipolar HIPIMS for thermal management

Prof. Ju-Liang He, Taiwan University, TW

10:30 - 11:00

Get together: Time2Network

 
 

Session 4 –
Industrial coating & advanced applications –
part 2

 
11:00 - 11:25

Coatings for aerospace

Prof. Jolanta Klemberg-Sapieha, Polytechnique Montréal, CN

11:25 - 11:30

Motto stop

 
11:30 - 11:50

Self-adjustment of the power supply for crazing elimination in large area coating

Krzysztof Ruda, TRUMPF Hüttinger, PL

11:50 - 12:10

Thin films of carbides and carbon-based nanocomposites

Prof. Witold Gulbinski, Koszalin University, PL

12:10 - 13:10

Lunch break

 
13:10 - 14:40

Group picture & company tour

 
14:40 - 15:40

Coffee @ poster session

 
 

Session 5 – Energy harvesting

 
15:40 - 16:05

New display technologies for new opportunities – new kinds of displays grow into multiple new markets

Klaus Wammes, Wammes & Partner, DE

16:05 - 16:30

Inductively coupled heating of pulsed plasmas

Joscha Schmidt, University Gießen, DE

16:30 - 16:50

Effect of HiPIMS pulse parameters on a reactive SiOx deposition process

Prof. Arutiun Ehiasarian, Sheffield Hallam University, UK

16:50 - 17:10

Latest developments in TOPCon PV cells

Dr.-Ing. Jochen Rentsch, Fraunhofer ISE, DE

17:10 - 17:30

Summary day 2

 
18:00

Evening reception

 

26.09.2019: Workshop: Modelling of process and application pit stops

08:50 - 09:00

Welcome, health and safety briefing

 
 

Session 6 – Modelling of deposition process – part 1

 
09:00 - 09:25

Modelling reactive magnetron sputtering: opportunities and challenges

Prof. Dr. Diederik Depla, Ghent University, B

09:25 - 09:45

Modelling of thin film deposition processes as a service

Dr. Andreas Pflug, Fraunhofer IST, DE

09:45 - 10:00

Get together: Time2Network

 
10:00 - 12:15

Application pit stop – part 1

Crazing prevention algorithm, HiPIMS – thinking positive, high power dual frequency systems

12:15 - 13:15

Lunch break

 
 

Session 6 – Modelling of deposition process – part 2

 
13:15 - 13:35

Efficient predictive simulation in thin film coating industry

Petr Zikan, PlasmaSolve, CZ

13:35 - 13:55

Application of design of experiment methods for power supply-related process parameters optimization

Dr Wojciech Gajewski, TRUMPF Hüttinger, PL

13:55 - 14:10

Get together: Time2Network

 
14:10 - 16:25

Application pit stop – part 2

IoT services – connected benefits, managing arcs, multifunctional synchronization

16:25 - 16:35

End of workshop

 

The agenda for 2019 is already fixed. We are happy to accept registrations for 2020.

Deadlines

Abstract submission

June 27th, 2019

Paper submission & biography  

September 6th, 2019

Presentation submission

September 16th, 2019

Contact: PE2@de.trumpf.com

Travel and accommodation

We would like to make your stay in Zielonka as pleasant as possible. The following includes important information regarding your trip.

Location

TRUMPF Huettinger Sp. z o.o. 
Marecka 47
05-220 Zielonka
Poland


Phone: +48 22 7613-800   or   +49-761-8971-0

We have booked room contingents in the following hotels

Hotel Trylogia
ul. Poniatowskiego 46
05-220 Zielonka
http://hoteltrylogia.pl/en/
34€/Night
 

Hotel Mistral
ul. Słoneczna 1
05-270 Marki
https://hotelmistral.pl/en/
44€/Night
 

Hotel Mansor
ul. ks. Ignacego Skorupki 3 i 5
05-091 Ząbki
http://www.mansor.pl/
63€/Night


Hotel U Pietrzaków
ul. Lipowa 20
05-220 Zielonka
http://upietrzakow.pl/
37€/Night



The room contingent is available until September 1st .
Please state "PE Conference" when booking your room.

Registration for PE²

Please use this form to register.

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Partner Program

partner program for accompanying persons will be available for 2019.

Further info available soon.

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