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TRUMPF 2025/26 Fiscal Year

TRUMPF closed the fiscal year with an increased order intake and significantly higher profit than in the previous year. Our order intake increased by 7 percent compared to 2025 (4.2 billion euros) to 4.5 billion euros. Earnings improved significantly to 476 million euros, compared with 59 million euros in the previous year. The EBIT margin increased significantly from 1.4 percent to 11.0 percent.

TRUMPF remains particularly innovative

Despite the challenging geopolitical environment, TRUMPF has remained an exceptionally innovative company that is breaking new ground as part of its growth strategy. This includes the semiconductor business unit, to which this annual report is dedicated. Together with our global partners, the semiconductor market represents a key growth driver for TRUMPF.

Prof. Dr. Nicola Leibinger-Kammüller

Semicon is a key growth driver

Amid all the excitement about AI and new business model ideas, one thing is sometimes overlooked: We also need outstanding hardware, as without it no chips in smartphones, data centers, or the cellular network would work. TRUMPF rightly sees itself at the forefront of this movement: as an enabler of the digital future.

2025/26 Annual Report
2025/26 Annual Report

Title: semicon

Financial figures

Sales
(mil. €)
Order intake
(mil. €)
R+D quota
(in percent)
Pre-tax earnings
(mil. €)
Employees as of June 30, 2026
(quantity)

We are the enablers of the digital future!

Without TRUMPF, there would be no AI. Our laser and plasma solutions are the backbone of modern semiconductor manufacturing. From EUV lithography to advanced packaging: Our technologies are used wherever the future is being created. Whether coating, laser exposure, or etching – anyone who wants innovation and progress cannot ignore TRUMPF. We think ahead: Our solutions not only enable peak performance, but also resource-saving processes. Together with leading technology partners, we develop innovations that transform entire industries.

Technology leadership

In the cleanroom in Ditzingen, Germany, components of a high-power laser for EUV lithography are being tested. The microchips manufactured using this process form the technological basis of AI and enable parallel processing of massive amounts of data in data centers.

Reliability

An employee in Zielonka, Poland, is testing electronic components. Assistance systems, sensors, and AI in electric vehicles require hundreds of specialized semiconductors. Without TRUMPF plasma generators, the production of these chips would be virtually impossible.

Quality

A quality manager is inspecting plasma generators at TRUMPF in Zielonka, Poland. The highest standards apply to the delivery of components to the chip industry. In modern medical technology, microchips are used to develop devices such as electron microscopes, which are used to develop medications.

Pioneering spirit

Laboratory staff are testing the mirror assembly of a high-power laser in a cleanroom in Schramberg, Germany. Lasers measure complex chip structures with the highest precision thus ensuring their manufacturing quality. Complex chips make it possible to process the enormous amount of data generated by digitally networked machines and systems in real time.

Partnership

A precision mechanic in Ditzingen, Germany, is assembling a high-performance EUV laser for ASML lithography systems. The high-performance chips made possible by this technology provide the technological basis for 6G networks and state-of-the-art smartphones, connecting people and devices in real time.

Responsibility

Employees are checking the parameters of plasma generators at the Technology Center in Taoyuan, Taiwan. They ensure the precise power supply of the plasma processes during chip production, thus providing the basis for high-precision semiconductors. Plasma is used to create high-performance chips with delicate structures that control systems such as solar farms, power grids, and consumer devices.

Precision

An employee at TRUMPF in Schramberg, Germany, is inspecting a laser capable of separating wafers into wafer-thin chips. Sensors in smartphones and wearables use this technology to detect movement, light levels, or biometric data.

Downloads

2025/26 Annual Report
2025/26 Annual Report

Title: semicon

Speach for the 2026 Annual Press Conference
Speach for the 2026 Annual Press Conference

By Prof. Nicola Leibinger-Kammüller, CEO TRUMPF Group

Presentation for the 2026 Annual Press Conference
Presentation for the 2026 Annual Press Conference
Press kit for the 2026 Annual Press Conference

Your press contact

Dr. Andreas Möller
Chief Communications and Public Affairs Officer
andreas.moeller(at)trumpf.com Phone +49 7156 30336824
Rainer Berghausen
Head of Group Communications, Spokesperson
rainer.berghausen(at)trumpf.com Phone +49 7156 30331720
Marleen Kledig
Executive Assistant Corporate and Management Communications
marleen.kledig(at)trumpf.com Phone +49 7156 30330408