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Power Electronics for Plasma Engineering Conference

15. - 17. Mai 2018 in Freiburg

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Programm
Impressions

Save the Date: 15. - 17.05.2018

Welche Themen bewegen die Anwender? Welche Trends zeichnen sich ab? Wie gestaltet sich die Zukunft auf dem Plasmamarkt? Diese Fragen standen bei der diesjährigen PE² unter dem Motto „generating progress“ im Mittelpunkt. Dabei hat sich die Power Electronics for Plasma Engineering Conference 2017 vor allem auf Glas-, PV-, industrielle und dekorative Beschichtungen konzentriert und Ideen und Anregungen für Ihren persönlichen Vorsprung geboten.

Programm 2017

Wie bereits in den vergangenen Jahren gab es auch 2017 zwei Konferenztage und einen Workshoptag. Neu war in diesem Jahr die Poster Session, die zusätzlich am ersten Konferenztag stattgefunden hat.

16.05.2017 Konferenztag 1

08:00 - 08:30	Registration
08:30 - 08:50	Welcome Speech	Dr. R. Bugyi, TRUMPF Huettinger, PL
08:50 - 09:40	Added Value through Surface Technology from a Leading Automotive and Industry supplier	Dr. Y. Musayev, Schaeffler, DE
	Session 1 Protective & Decorative Coatings
09:40 - 10:05	Overview and developments in PVD: a sustainable technology for protective coatings	D. Doerwald, R. Tietema, Hauzer Techno-Coating B.V., NL
10:05 - 10:30	Importance of ARC management for sputtering of challenging semiconductor materials	B. Clark-Phelps, M. Latusek, First Solar, US
10:30 - 10:55	Process and film properties modification by reverse voltage and pulse parameters settings in reactive deposition of optical and functional coatings	P. Lesiuk, TRUMPF Huettinger, PL
10:55 - 11:25	Get together: Time2Network
	Session 2 New Technologies for PVD
11:25 - 11:50	Taking advantage of the digital twin in sputtering	Prof. Dr. B. Szyszka, Technical University Berlin, DE
11:50 - 12:15	Modelling of collective phenomena in magnetron sputtering plasma discharges	Dr. A. Pflug, Fraunhofer-Institut IST, DE
12:15 - 12:40	Flake graphene – new perspectives for innovative technologies	Dr. L. Lipińska, Institute of Electronic Materials Technology, PL
12:40 - 13:05	Impact analysis of power source operating parameters with particular emphasis of hardness, adhesion and film composition of TiN layer applied on HSS, Si, SiO2 substrates	K. Ruda, TRUMPF Huettinger, PL
13:05 - 14:00	Lunch break
14:00 - 15:00	Poster session
15:00 - 15:15	Get together: Time2Network
	Session 3 Industrial Applications of HiPIMS
15:15 - 15:40	Reactive HiPIMS-Effective method for deposition of oxynitride films with smoothly controlled composition	Prof. J. Vlcek, University of West Bohemia, CZ
15:40 - 16:05	Silver ultrathin Metal Film Deposited by Using HiPIMS	Dr. J.-L. He, Feng Chia University of Taiwan, TW
16:05 - 16:30	Low temperature deposition of molybdenum and titania on glass by high power impulse magnetron sputtering	Prof. A. P. Ehiasarian, Sheffield Hallam University, UK
16:30 - 16:55	Titanium based decorative coatings properties control utilizing pulse shaping in state-of-the-art HiPIMS technology	Dr. P. Ozimek, TRUMPF Huettinger, PL
16:55 - 17:05	Conclusion day 1
17:05	Group picture
19:00	Evening Event

16.05.2017 Poster Session

Influence of intrinsic and extrinsic doping of TiO2 thin films deposited by RF sputtering on the structural, electrical and optical properties	Dr. I. Luciu, TRUMPF Hüttinger, DE
Frequency effects in dual magnetron Sputtering	Dr. M. Heintze, TRUMPF Hüttinger, DE
Avoiding nodule growth in reactive DMS of silicon based dielectric films	Dr. M. Heintze, TRUMPF Hüttinger, DE
Cylindrical magnetron with multiple dynamic areas of toroidal plasma	Dr. M. Betiuk, Institute of Precision Mechanics, PL
tbd	Dr. Ł. Skowroński, University of Science & Technology, PL
The hollow cathode GFS: New conditions for the old materials	Dr. R. Muydinov, Technical University Berlin, DE
The influence of the reactive gas flow on the structure and properties of TiAlCN/VCN films	Dr. A. Oniszczuk, Sheffield Hallam University
Dielectric and conductive materials fabricated by means of RF plasma enhanced methods for semiconductor structures – technology and applications	Dr. R. Mroczynski, Institute of Microelectronics & Optoelectronics, Warsaw University of Technology
Pulse width modulated rectiers - new challenge and possibilities for industrial power electronic systems	Prof. J. Rabkowski, Warsaw University of Technology/TPLE
Advantages of Waveform Adaptability in Low Frequency PECVD Applications	J. Świątnicki, TRUMPF Huettinger, PL
Methods for improved humidity insusceptibility of full water cooled plasma generators	P. Lesiuk, TRUMPF Huettinger, PL
Benefits of dual usage Pulsed-DC power supplies	Dr. W. Gajewski, TRUMPF Huettinger, PL
RF power sources for ALD processes	A. Dziułko, TRUMPF Huettinger, PL
Shape matters - bipolar sputtering	K. Ruda, TRUMPF Huettinger, PL
HIPIMS – New possibilities for industrial applications	P. Różański, TRUMPF Huettinger, PL
High power dual frequency systems	W. Głazek, TRUMPF Huettinger, PL

17.05.2017 Konferenztag 2

08:50 - 09:00	Welcome - start of the conference	Dr.-Ing. Stephan Mayer,TRUMPF Hüttinger, DE
	Session 4 Plasma Processing
09:00 - 09:25	Highlights in modeling the reactive magnetron sputtering process	Dr. K. Strijckmans, Ghent University, BE
09:25 - 09:50	HiPIMS deposited CrN/NbN coatings to preserve the mechanical properties of the substrate material and protect against steam oxidation and water droplet erosion attacks	Prof. P. Eh. Hovsepian, Sheffield Hallam University, UK
09:50 - 10:15	Sputtering and post treatment of low temperature TCO layers	Dr. F. Schwarz, Solayer, DE
10:15 - 10:40	Nodule formation on sputtering targets: Causes and their control by modern MF power supplies	Dr. M. Heintze, TRUMPF Hüttinger, DE
10:40 - 11:15	Get together: Time2Network
	Session 5 Technology Advancement & Process Trends
11:15 - 11:40	Some recent developments in sputter technology	Prof. Dr. G. Bräuer, Fraunhofer Institute for Surface Engineering and Thin Films, DE
11:40 - 12:05	ProChina and its developed technologies	Q. Dong, ProChina, CN
12:05 - 12:30	Productivity improvement potential in MF PVD/PECVD applications which focus on glass coating and display	Dr. I. Luciu, TRUMPF Hüttinger, DE
12:30 - 13:30	Lunch break
13:30 - 15:00	Company tour
15:00 - 15:30	Get together: Time2Network
	Session 6 PV & Solar Applications
15:30 - 15:55	Challenges in CIGS technology	Dr. R. Reichel, Avancis, DE
15:55 - 16:20	Sputtered front surface mirrors with high temperature stability for solar thermal power plants	Dr. A. Georg, Fraunhofer Institute for Solar Energy Systems, DE
16:20 - 16:45	Characterization of an ICP source for photovoltaic applications	Dr. S. Hübner, Singulus Technologies, DE
16:45 - 17:10	The PV market and RF technology applications for heterojunction solar cells at Meyer & Burger	C. Schmidt, Meyer Burger, DE
17:10 - 17:35	Dual frequency systems for etch applications	W. Glazek, TRUMPF Huettinger, PL
17:35 - 18:00	Conclusion of the conference

18.05.2017 Workshop

08:00 - 08:30	Welcome + Health and safety briefing	M. Puzniak, TRUMPF Huettinger, PL
08:30 - 09:00	HiPIMS – The Breakthrough in coatings for Cutting Tools	Dr. C. Schiffers, CemeCon, DE
	Session 1 DC Panel
09:00 - 10:30	Flexibility of reactive processes by application of modern dual-usage Pulsed-DC power supply	P. Lesiuk, TRUMPF Huettinger, PL	Parallel Session - Questions & Answers - Device experience
10:30 - 11:00	Get together: Time2Network
	Session 2 HiPIMS Panel
11:00 - 12:30	Advanced current pulse shape and average power delivery for industrial application of HiPIMS sputtering	P. Różański, TRUMPF Huettinger, PL	Parallel Session - Questions & Answers - Device experience
12:30 - 13:30	Lunch break
13:30 - 14:00	Innovative optical coatings for active and passive solar glass facades	Dr. A. Schüler, EPFL, CH
	Session 3 RF/Matchbox Panel
14:00 - 15:30	Optimized System Approach for Dual-Frequency Plasma Applications	Dr . D. Krausse, TRUMPF Hüttinger, DE W. Głazek, TRUMPF Huettinger, PL	Parallel Session - Questions & Answers - Device experience
15:30 - 16:00	Get together: Time2Network
	Session 4 Bipolar Panel
16:00 - 17:30	Versatility of Bipolar sputtering for various coating applications: from hard coating to reactive sputtering of insulating and conductive oxide films	J. Świątnicki, TRUMPF Huettinger, PL	Parallel Session - Questions & Answers - Device experience
17:30 - 17:45	Conclusions of conference
18:00	End of the conference
Treffen Sie unsere Ingenieure! Parallel zum Workshop veranstalten wir eine "Frage und Antwort Runde". Hier können Sie Ihre Fachkenntnisse über die Prozessstromversorgung erhöhen und bekommen all Ihre Fragen zu den Geräten und deren Einstellungen beantwortet.