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Power Electronics for Plasma Engineering Conference

15. - 17. Mai 2018 in Freiburg

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  • Programm
  • Impressions
  • Mehr weniger

Save the Date: 15. - 17.05.2018

Welche Themen bewegen die Anwender? Welche Trends zeichnen sich ab? Wie gestaltet sich die Zukunft auf dem Plasmamarkt? Diese Fragen standen bei der diesjährigen PE² unter dem Motto „generating progress“ im Mittelpunkt. Dabei hat sich die Power Electronics for Plasma Engineering Conference 2017 vor allem auf Glas-, PV-, industrielle und dekorative Beschichtungen konzentriert und Ideen und Anregungen für Ihren persönlichen Vorsprung geboten.

 

 

Programm 2017

Wie bereits in den vergangenen Jahren gab es auch 2017 zwei Konferenztage und einen Workshoptag. Neu war in diesem Jahr die Poster Session, die zusätzlich am ersten Konferenztag stattgefunden hat.

16.05.2017 Konferenztag 1

08:00 - 08:30Registration
08:30 - 08:50Welcome SpeechDr. R. Bugyi, TRUMPF Huettinger, PL
08:50 - 09:40Added Value through Surface Technology from a Leading Automotive and Industry supplierDr. Y. Musayev, Schaeffler, DE
Session 1
Protective & Decorative Coatings
09:40 - 10:05Overview and developments in PVD: a sustainable technology for protective coatingsD. Doerwald, R. Tietema, Hauzer Techno-Coating B.V., NL
10:05 - 10:30Importance of ARC management for sputtering of challenging semiconductor materialsB. Clark-Phelps, M. Latusek, First Solar, US
10:30 - 10:55Process and film properties modification by reverse voltage and pulse parameters settings in reactive deposition of optical and functional coatingsP. Lesiuk,
TRUMPF Huettinger, PL
10:55 - 11:25Get together: Time2Network
Session 2
New Technologies for PVD
11:25 - 11:50Taking advantage of the digital twin in sputteringProf. Dr. B. Szyszka, Technical University Berlin, DE
11:50 - 12:15Modelling of collective phenomena in magnetron sputtering plasma dischargesDr. A. Pflug, Fraunhofer-Institut IST, DE
12:15 - 12:40Flake graphene – new perspectives for innovative technologiesDr. L. Lipińska, Institute of Electronic Materials Technology, PL
12:40 - 13:05Impact analysis of power source operating parameters with particular emphasis of hardness, adhesion and film composition of TiN layer applied on HSS, Si, SiO2 substratesK. Ruda, TRUMPF Huettinger, PL
13:05 - 14:00Lunch break
14:00 - 15:00Poster session
15:00 - 15:15Get together: Time2Network
Session 3
Industrial Applications of HiPIMS
15:15 - 15:40Reactive HiPIMS-Effective method for deposition of oxynitride films with smoothly controlled compositionProf. J. Vlcek, University of West Bohemia, CZ
15:40 - 16:05Silver ultrathin Metal Film Deposited by Using HiPIMSDr. J.-L. He, Feng Chia University of Taiwan, TW
16:05 - 16:30Low temperature deposition of molybdenum and titania on glass by high power impulse magnetron sputteringProf. A. P. Ehiasarian, Sheffield Hallam University, UK
16:30 - 16:55Titanium based decorative coatings properties control utilizing pulse shaping in state-of-the-art HiPIMS technologyDr. P. Ozimek, TRUMPF Huettinger, PL
16:55 - 17:05Conclusion day 1
17:05Group picture
19:00Evening Event

16.05.2017 Poster Session

Influence of intrinsic and extrinsic doping of TiO2 thin films deposited by RF sputtering on the structural, electrical and optical propertiesDr. I. Luciu, TRUMPF Hüttinger, DE
Frequency effects in dual magnetron Sputtering Dr. M. Heintze, TRUMPF Hüttinger, DE
Avoiding nodule growth in reactive DMS of silicon based dielectric filmsDr. M. Heintze, TRUMPF Hüttinger, DE
Cylindrical magnetron with multiple dynamic areas of toroidal plasmaDr. M. Betiuk, Institute of Precision Mechanics, PL
tbdDr. Ł. Skowroński, University of Science & Technology, PL
The hollow cathode GFS: New conditions for the old materialsDr. R. Muydinov, Technical University Berlin, DE
The influence of the reactive gas flow on the structure and properties of TiAlCN/VCN filmsDr. A. Oniszczuk, Sheffield Hallam University
Dielectric and conductive materials fabricated by means of RF plasma enhanced methods for semiconductor structures – technology and applicationsDr. R. Mroczynski, Institute of Microelectronics & Optoelectronics, Warsaw University of Technology
Pulse width modulated rectiers - new challenge and possibilities for industrial power electronic systems  Prof. J. Rabkowski, Warsaw University of Technology/TPLE
Advantages of Waveform Adaptability in Low Frequency PECVD ApplicationsJ. Świątnicki, TRUMPF Huettinger, PL
Methods for improved humidity insusceptibility of full water cooled plasma generatorsP. Lesiuk, TRUMPF Huettinger, PL 
Benefits of dual usage Pulsed-DC power suppliesDr. W. Gajewski, TRUMPF Huettinger, PL
RF power sources for ALD processesA. Dziułko, TRUMPF Huettinger, PL 
Shape matters - bipolar sputteringK. Ruda, TRUMPF Huettinger, PL 
HIPIMS – New possibilities for industrial applications P. Różański, TRUMPF Huettinger, PL 
High power dual frequency systems W. Głazek, TRUMPF Huettinger, PL 

17.05.2017 Konferenztag 2

08:50 - 09:00Welcome - start of the conferenceDr.-Ing. Stephan Mayer,TRUMPF Hüttinger, DE
Session 4
Plasma Processing
09:00 - 09:25Highlights in modeling the reactive magnetron sputtering processDr. K. Strijckmans, Ghent University, BE
09:25 - 09:50HiPIMS deposited CrN/NbN coatings to preserve the mechanical properties of the substrate material and protect against steam oxidation and water droplet erosion attacksProf. P. Eh. Hovsepian, Sheffield Hallam University, UK
09:50 - 10:15Sputtering and post treatment of low temperature TCO layersDr. F. Schwarz, Solayer, DE
10:15 - 10:40Nodule formation on sputtering targets: Causes and their control by modern MF power suppliesDr. M. Heintze, TRUMPF Hüttinger, DE
10:40 - 11:15Get together: Time2Network
Session 5
Technology Advancement & Process Trends
11:15 - 11:40Some recent developments in sputter technologyProf. Dr. G. Bräuer, Fraunhofer Institute for Surface Engineering and Thin Films, DE
11:40 - 12:05ProChina and its developed technologiesQ. Dong, ProChina, CN
12:05 - 12:30Productivity improvement potential in MF PVD/PECVD applications which focus on glass coating and displayDr. I. Luciu, TRUMPF Hüttinger, DE
12:30 - 13:30Lunch break
13:30 - 15:00Company tour
15:00 - 15:30Get together: Time2Network
Session 6
PV & Solar Applications
15:30 - 15:55Challenges in CIGS technologyDr. R. Reichel, Avancis, DE
15:55 - 16:20Sputtered front surface mirrors with high temperature stability for solar thermal power plantsDr. A. Georg, Fraunhofer Institute for Solar Energy Systems, DE
16:20 - 16:45Characterization of an ICP source for photovoltaic applicationsDr. S. Hübner, Singulus Technologies, DE
16:45 - 17:10The PV market and RF technology applications for heterojunction solar cells at Meyer & BurgerC. Schmidt, Meyer Burger, DE
17:10 - 17:35Dual frequency systems for etch applicationsW. Glazek, TRUMPF Huettinger, PL
17:35 - 18:00Conclusion of the conference

18.05.2017 Workshop

08:00 - 08:30Welcome + Health and safety briefingM. Puzniak, TRUMPF Huettinger, PL
08:30 - 09:00HiPIMS – The Breakthrough in coatings for Cutting ToolsDr. C. Schiffers, CemeCon, DE
Session 1
DC Panel
09:00 - 10:30Flexibility of reactive processes by application of modern dual-usage Pulsed-DC power supplyP. Lesiuk, TRUMPF Huettinger, PL

Parallel Session - Questions & Answers - Device experience

10:30 - 11:00Get together: Time2Network
Session 2
HiPIMS Panel
11:00 - 12:30Advanced current pulse shape and average power delivery for industrial application of HiPIMS sputteringP. Różański, TRUMPF Huettinger, PL

Parallel Session - Questions & Answers - Device experience

12:30 - 13:30Lunch break
13:30 - 14:00Innovative optical coatings for active and passive solar glass facadesDr. A. Schüler, EPFL, CH
Session 3
RF/Matchbox Panel
14:00 - 15:30Optimized System Approach for Dual-Frequency Plasma Applications Dr . D. Krausse, TRUMPF Hüttinger, DE
W. Głazek, TRUMPF Huettinger, PL

Parallel Session - Questions & Answers - Device experience

15:30 - 16:00Get together: Time2Network
Session 4
Bipolar Panel
16:00 - 17:30Versatility of Bipolar sputtering for various coating applications: from hard coating to reactive sputtering of insulating and conductive oxide filmsJ. Świątnicki, TRUMPF Huettinger, PL

Parallel Session - Questions & Answers - Device experience

17:30 - 17:45Conclusions of conference
18:00End of the conference
Treffen Sie unsere Ingenieure!
Parallel zum Workshop veranstalten wir eine "Frage und Antwort Runde". Hier können Sie Ihre Fachkenntnisse über die Prozessstromversorgung erhöhen und bekommen all Ihre Fragen zu den Geräten und deren Einstellungen beantwortet.

PE² 2017 - a review

Unter dem Motto „generating progress“ beschäftigte sich die Konferenz 2017 vor allem mit Glas-, PV-, industriellen und dekorativen Beschichtungen. 

Wie bereits 2016 rückten wir die Praxis in den Fokus und kombinierten theoretische und praktische Inhalte:

Impressions 2017

Spannende Technologieeinblicke durch Theorievorträge renommierter Plasmaexperten.

Neu war in diesem Jahr die Poster Session, die zusätzlich am ersten Tag stattfand.

Company tour

Evening Event

Downloads

pdf

11.05.2017
715 KB
Agenda PE² 2017

Here you can find our 2017 agenda as PDF.

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