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Wafer Dicing
10/02/2026
Semicon Korea trade fair

LIDROTEC and TRUMPF accelerate wafer dicing in the chip industry

Martin Krämer
05/02/2026

Smart Factory on a small scale: Discover how a third pallet station increases productivity

27/01/2026

Nine safety requirements your machine needs to meet

22/01/2026

TRUMPF automation brings a breath of fresh air to the factory

08/01/2026

Lasers instead of makeshift solutions: “We have found the solution to space debris”

Press releases

Semicon Korea trade fair: LIDROTEC and TRUMPF accelerate wafer dicing in the chip industry

TRUMPF presents Supplier Awards: Recognition for quality, transparency, and innovative spirit

Semicon Japan trade fair: TRUMPF reduces manufacturing costs in the chip industry with laser and plasma technology

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TRUMPF Magazine

Whether printed or digital: with our customer magazines, you can dive even deeper into the world of sheet metal and lasers, new product developments  or stories from users all over the world. 

Fiscal year 2024/25

TRUMPF has had an extremely challenging financial year, which is reflected in the decline in sales of 4.3 billion euros and order intake of 4.2 billion euros. Earnings before interest and taxes (EBIT) fell to EUR 59 million (previous year: EUR 501 million) as a result of the decline in sales, but also due to necessary structural measures. The EBIT margin fell to 1.4% (previous year: 9.7%).

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