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To MyTRUMPF
Other countries/regions | EN
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To MyTRUMPF
Build-to-spec / R&D Engineering services

Electrical engineering

  • Automation systems / control technology (e.g. high-speed digital design)

  • Power electronics

Software

  • FPGA

  • µC

PCB design

  • High density (75 µm, 0201)

  • High currents (up to 250 A)

  • High-speed applications (ps range)

Mechanical design


Electrical and thermal simulation
Build-to-print / contract manufacturing

SMT / THT

  • 8 SMT lines (Fuji)

Soldering

  • Reflow, 12 zones

  • Vapor phase soldering

  • Selective soldering

PCBA test

  • AOI 2.5D

  • ICT (also Flying Probe)

Module test

  • Individual function checks

  • Commissioning / start-up

  • Burn-in
Qualification services

  • Electromagnetic compatibility (EMC)

  • Artificial ageing test (HALT)

  • Power system test
Rapid prototyping

  • Samples in 2 weeks (subject to availability of materials in stock)

  • LPKF printed circuit board milling machine

  • In-house multilayer press brake

  • Wide range of PCB materials