Short and ultrashort pulse lasers
Short and ultrashort pulse lasers from TRUMPF are the ideal industry-ready tool for microprocessing. They are well-suited for all standard processing methods such as cutting, drilling, ablating and structuring, in a wide range of materials. The bandwidth of the TruMicro Series ranges from nanosecond lasers (ns-lasers) to ultrashort pulse lasers, picosecond lasers and femtosecond lasers (ps- and fs-lasers). The ps-lasers and fs-lasers enable cold processing of the material even at moderate average power, meaning that there is practically no heat input on the workpiece. The average laser powers of the short and ultrashort pulse lasers from TRUMPF range from just a few watts to several hundred watts. The high peak pulse powers are unrivalled, with the total costs remaining extremely low over the full life cycle.
TruMicro Series 2000
The fibre-based ultrashort pulse lasers in the TruMicro Series 2000 are distinguished by their compact and light design. Its moderate average power and high beam quality will open up applications in new areas for you, such as medical technology and foil processing.
TruMicro Series 5000
Quick and cost-effective processing of various materials with lasers from the TruMicro Series 5000. These work with an optimal combination of quality, productivity and profitability, with no limits in terms of industrial suitability. The picosecond and femtosecond lasers impress with their extremely short pulses and high pulse energy of up to 500 μJ.
TruMicro Series 7000
The high-performance nanosecond lasers of the TruMicro Series 7000 combine short pulses with high pulse energies, even at high frequencies. They are therefore best-suited to large-scale and quick ablation, drilling, or cutting with maximum throughput.
TruMicro Series 7000 UV
The high-power TruMicro Series 7000 UV short-pulse laser is highly productive and works at an ultraviolet wavelength. The combination of short pulses and high pulse energies create the ideal conditions to manufacture flexible OLED displays using laser lift-off processes. They are therefore best-suited to large-scale and quick ablation, drilling or cutting with maximum throughput.