Data Centers & AI Infrastructure

From the microchips powering AI to the infrastructure that moves and sustains data, TRUMPF technologies help build the foundation of modern progress. For over 100 years, TRUMPF has empowered manufacturers to turn complex ambition into reality with precision, reliability, and innovation at scale.

The Technology Behind Global Progress

Engineer showing a computer microchip on motherboard background. Electronic circuit board with processor

Microchips - EUV

From EUV lithography to advanced packaging, TRUMPF laser and plasma technologies are at the core of modern semiconductor manufacturing. TRUMPF enables the processes that makes microchip innovation possible.

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Sheet Metal Components - Machine Tools

TRUMPF laser cutting, tube cutting, bending, punching, and welding technologies enable the precise and efficient production of data center infrastructure, including server racks, cable trays, enclosures, cooling systems, and energy components.

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News, Articles, and Interviews

Copper welds via green laser create superfast data center connections

Pierson Cheng and Dr. Woo-Sik Chung of TRUMPF discuss the importance of flawless data transmission and how TRUMPF green lasers produce precise welds of copper connections in Laser Focus World.

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Tailor-Made Automated Bending

TRUMPF Inc. Automated Bending Product Manager, Sebastian Leeb, discusses how versatile bending options support the data center boom in a recent FF Journal article.

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