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TruPulse nano | TRUMPF
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Short and ultrashort pulse lasers

TruPulse nano

Unrivaled versatility in nanosecond processing

Versatility for a wide range of applications

Our Pulsed Fiber Lasers using GTWave and PulseTune technologies are among the most versatile industrial laser in our portfolio. Operating in the nanosecond pulse duration regime these lasers are widely used in a diverse range of industrial applications, offering users unrivalled flexibility. Maintenance free, utilising ‘Fit & Forget’ technology, our lasers allow you to focus on output, rather than time consuming and costly maintenance schedules.

Flexibility

Produce permanent marks with a non-contact process at high speed with high precision. Laser marking requires no consumables and marks are computer generated and are therefore highly flexible.

Innovative Technology

The pinnacle of pulsed nanosecond technology, with enhanced features for micro-machining, moving our PulseTune enabled Lasers to a new level. PulseTune technology offers the OEM integrator highly flexible control over pulse width and peak power. The unique PulseTune function enables market leading repetition rates whilst maintaining peak power.

Versatility

Up to 48 selectable waveforms. The ability to optimise key pulse characteristics to individual applications gives enhanced process quality and productivity.

No Maintenance

Maintenance free, utilising ‘Fit & Forget’ technology, allowing you to focus on output, rather than time consuming maintenance schedules.

viewport test images /w Retina support

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Welding

Regardless of the material, thickness, or dissimilar metals, our lasers have the inbuilt versatility to weld everything from fuel cells and batteries, through to fine wires for medical device manufacture. Our patented ns welding process can join just about any metal or combination of metals; including highly reflective and conductive metals to create robust joints in thin-section metals.

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Drilling

Laser drilling is achieved by pulsing a laser beam on a particular area repeatedly. The material subject to laser drilling is vaporised and melted layer by layer until drill holes are created. Drilling with lasers is renowned for its high levels of precision, which can be managed carefully by monitoring beam intensity and duration.

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Cutting

The laser beam can easily be programmed to precision cut a diverse range of thicknesses and materials (e.g. metals (including reflective metals such as copper, silver and aluminium) – brass, tungsten, steel, pewter and titanium etc.), gemstones (e.g. diamonds), ceramics, graphic composites, silicon and many types of plastics. Even the most complex, particular and intricate of shapes can be accurately cut as the user has total control over the beam intensity, duration and heat input.

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Marking and engraving

The appliance of a mark is at a surface level, whereas engraving is a mark with depth. Almost any material can be laser marked in black or, for some materials, even in colour. Laser marking is used on ceramics, plastics, metals, LEDs, rubber, graphic composites, and others.

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Layer Ablation

Precision layer removal from metals and industrial compounds such as elements used within electronic products (e.g. semi-conductors and micro-processors).

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Cleaning

Cleaning applications typically use high repetition rates and short pulses with high peak powers – ideal of nanosecond pulsed lasers. The intention is to remove surface debris and contaminated layers without damaging the substrate materials. This is a low-cost and environmentally-friendly laser application technique, which is in widespread use throughout global industry.

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Laser parameters                   
Average output power 20 W 20 W 30 W 50 W 100 W 20 W 30 W 50 W 50 W 70 W 70 W 100 W 130 W 200 W 20 W 20 W 70 W 200 W
Maximum peak pulse power > 7 kW > 7 kW > 7 kW > 7 kW > 7 kW > 10 kW > 10 kW > 10 kW > 10 kW > 10 kW > 10 kW > 10 kW > 10 kW > 10 kW > 12 kW > 12 kW > 20 kW > 50 kW
Beam quality (M²) < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.6 < 1.6 < 1.6 < 1.6 < 1.6 < 1.6 < 1.6 < 1.6 < 1.6 < 1.8 1.8 3 < 5
Wavelength 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm 1062 nm ± 3 nm
Maximum pulse energy > 0.6 mJ > 0.6 mJ > 0.6 mJ > 0.6 mJ > 1 mJ > 1 mJ > 1 mJ > 1 mJ > 1 mJ > 1 mJ > 1 mJ > 1.3 mJ > 1.5 mJ > 1.5 mJ > 1 mJ > 0.8 mJ > 1.25 mJ > 5 mJ
Pulse duration range 3 ns - 500 ns 10 ns - 240 ns 10 ns - 240 ns 11 ns - 220 ns 4 ns - 2000 ns 3 ns - 500 ns 26 ns - 250 ns 6 ns - 500 ns 26 ns - 250 ns 9 ns - 500 ns 28 ns - 260 ns 4 ns - 2000 ns 3 ns - 2000 ns 9 ns - 2000 ns 10 ns - 220 ns 2 ns - 500 ns 10 ns - 250 ns 12 ns - 2000 ns
Pulse repetition frequency 1 kHz - 1000 kHz 1 kHz - 1000 kHz 1 kHz - 1000 kHz 1 kHz - 1000 kHz 1 kHz - 4000 kHz 1 kHz - 1000 kHz 1 kHz - 500 kHz 1 kHz - 1000 kHz 1 kHz - 500 kHz 1 kHz - 1000 kHz 1 kHz - 500 kHz 1 kHz - 4000 kHz 1 kHz - 4000 kHz 1 kHz - 4000 kHz 1 kHz - 1000 kHz 1 kHz - 1000 kHz 1 kHz - 1000 kHz 1 kHz - 4000 kHz
Wavelength spectrum 1059 nm - 1065 nm
Structural design                   
Dimensions (W x H x D) 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 377 mm x 249 mm x 115 mm 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 377 mm x 249 mm x 95 mm 377 mm x 249 mm x 95 mm 377 mm x 249 mm x 115 mm 423 mm x 417 mm x 133 mm 423 mm x 417 mm x 133 mm 347 mm x 201 mm x 95 mm 347 mm x 201 mm x 95 mm 377 mm x 249 mm x 95 mm 473 mm x 417 mm x 133 mm
Installation                   
Ambient temperature 0 °C - 45 °C 0 °C - 45 °C 0 °C - 45 °C 0 °C - 42 °C 5 °C - 40 °C 0 °C - 45 °C 0 °C - 45 °C 0 °C - 40 °C 0 °C - 40 °C 0 °C - 40 °C 0 °C - 40 °C 0 °C - 40 °C 10 °C - 45 °C 10 °C - 40 °C 0 °C - 45 °C 0 °C - 45 °C 0 °C - 40 °C 10 °C - 40 °C
Beam quality options

S Type (Single mode M² <1.3): Generating very fine spot size <20 microns with high power stability and large depth of focus. Ideally suited to applications requiring small feature sizes.

Z Type (M² <1.6): Offering higher peak power and pulse energy with only minor increase in spot size with good depth of focus.

L Type (Low Mode M² 1.6 – 2.0): General marking applications giving slightly larger spots and features that are more appropriate to making marks visible to the naked eye.

H Type (High mode M² 2.5 – 3.5): Offering high pulse energies, and peak powers and even larger spots ideal for wide lines, filled font type applications and large area coverage.

M Type (Multimode (M² 4.0 – 6.0): Highest pulse energies and longer pulse durations ideal for welding and cleaning.

PulseTune series

Depending on your requirements, you can choose between several products within our PulseTune series.

The entry-level products of the RM series (Reduced Mode) have limited pulse options as well as basic software and hardware interfaces. With these models you can use 2 PulseTune waveforms and work with a limited pulse repetition frequency of up to 500 kHz.

With the models of the HS series (High Spec) you benefit from our PulseTune technology and a variable pulse width with 25 pre-set waveforms. Thanks to enhanced control and modulated CW functionality, you can work even more precisely. The pulse repetition frequency is up to 1 MHz.

In the EP series (Extended Performance) you can choose between up to 48 optimized PulseTune waveforms. With this, we offer you our most versatile fiber laser source with improved control and modulated CW functionality. In addition, the pulse energy and peak power performance are increased. The pulse width range is between 3-2000 ns, the pulse repetition frequency is up to 4 MHz

This product range and information may vary depending on the country. Subject to changes to technology, equipment, price and range of accessories. Please get in touch with your local contact person to find out whether the product is available in your country.

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