LDMOS chiller made of pure copper
The use of an additively manufactured cooler made of pure copper boosts cooling capacity for the LDMOS chips (laterally-diffused metal-oxide semiconductor chips) and permits over-clocking to enhance performance. The printed copper has a heat conductivity of 394 W/(m*K).
Pure copper cooling
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Facts & figures about the example part
Material: pure copper
Weight: 13.7 g
Build time: 24 h (75 parts for 100 mm round substrate plate)
Created by: TRUMPF