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TRUMPF 2025/26 fiscal year

TRUMPF closed the fiscal year with an increase in orders received and a significantly higher profit than in the previous year. Our order intake rose by 7% to 4.5 billion euros compared with  2025 (4.2 billion euros). Profit improved significantly to 476 million euros, compared with 59 million euros in the previous year. The EBIT yield rose significantly from 1.4% to 11.0%.

TRUMPF remains an innovation leader

Despite the challenging geopolitical environment, TRUMPF has remained an extremely innovative company that is breaking new ground as part of its growth strategy. This includes the semiconductors business segment, to which this annual report is dedicated. Together with our global partners, the semiconductor market represents a key growth driver for TRUMPF.

Prof. Dr. Nicola Leibinger-Kammüller

Semicon as a key growth driver

Amidst all the excitement about AI and new business model ideas, one thing is sometimes overlooked: Outstanding hardware is also essential; without it, no chip in a smartphone, data centre or mobile network would work. TRUMPF rightly sees itself at the forefront of this movement: as an enabling force behind the digital future!

2025/26 Annual Report
2025/26 Annual Report

Title: semicon

Financial figures

Turnover
(mil. euros)
Orders received
(mil. euros)
R+D quota
(in percent)
Pre-tax earnings
(mil. euros)
Employees as of 30 June 2026
(Number)

We are the enablers of the digital future!

Without TRUMPF, there would be no AI. Our laser and plasma solutions are the backbone of modern semiconductor manufacturing. From EUV lithography to advanced packaging, our technologies are used in all areas where the future is being created. From coating to exposing and etching – if you want innovation and progress, TRUMPF is the only choice. We think beyond the obvious: our solutions don't just enable maximum performance, they also help conserve resources. We work with leading technology partners to develop innovations that transform entire industries.

Technological leadership

In the cleanroom in Ditzingen, Germany, components of a high-power laser for EUV lithography are being tested. The microchips manufactured using this process form the technological basis of AI and enable the parallel processing of vast amounts of data in data centres.

Reliability

An employee in Zielonka, Poland, is testing electronic components. The assistance systems, sensors and AI in electric cars require hundreds of specialised semiconductors. Without TRUMPF plasma generators, the production of these chips would be virtually impossible.

Quality

At TRUMPF in Zielonka, Poland, a quality manager inspects plasma generators. The highest standards apply to the delivery of components to the chip industry. In modern medical technology, microchips enable the development of devices such as electron microscopes, which are used to develop medications.

Pioneering spirit

Laboratory staff are testing the mirror assembly of a high-power laser in a cleanroom in Schramberg, Germany. Lasers measure complex chip structures with the utmost precision to ensure their manufacturing quality. Complex chips make it possible to process the enormous amounts of data generated by digitally networked machines and systems in real time.

Partnership

A precision engineer in Ditzingen, Germany, is assembling a high-power EUV laser for ASML's lithography systems. The high-performance chips made possible by this technology form the technological basis for 6G networks and state-of-the-art smartphones, connecting people and devices in real time.

Responsibility

Employees are checking the parameters of plasma generators at the Taoyuan Technology Center in Taiwan. They ensure a precise power supply for the plasma processes used in chip manufacturing, thereby laying the foundation for high-precision semiconductors. Plasma is used to create high-performance chips with intricate structures that control systems such as solar farms, power grids and consumer devices.

Precision

An employee at TRUMPF in Schramberg, Germany, inspects a laser capable of separating wafers into ultra-thin chips. Sensors in smartphones and wearables use this technology to detect movement, brightness and biometric data.

Downloads

2025/26 Annual Report
2025/26 Annual Report

Title: semicon

Speech at the 2026 Annual Press Conference
Speech at the 2026 Annual Press Conference

By Prof. Dr. Nicola Leibinger-Kammüller, CEO TRUMPF Group

Presentation for the 2026 Annual Press Conference
Presentation for the 2026 Annual Press Conference
Press pack for the 2026 Annual Press Conference

Your press contact

Dr. Andreas Möller
Chief Communications and Public Affairs Officer
andreas.moeller(at)trumpf.com Telephone +49 7156 30336824
Rainer Berghausen
Head of Group Communications, Spokesperson
rainer.berghausen(at)trumpf.com Telephone +49 7156 30331720
Marleen Kledig
Executive Assistant Corporate and Management Communications
marleen.kledig(at)trumpf.com Telephone +49 7156 30330408