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Microprocessing lasers

TRUMPF lasers work in the micrometer range and adhere reliably to even the narrowest tolerances. Short, powerful laser pulses vaporise the material directly, leaving the surrounding area virtually untouched. Residues are minimal, so there is usually no need for cleaning or manual rework. This precision enables micro-cutting, micro-welding, structuring and drilling – even with thin metals, foils, plastics, silicon, ceramics or glass. Finest components retain their shape, and surfaces remain flawless. With high processing speeds, our lasers are particularly suitable for microelectronics, precision mechanics, medical technology and semiconductor manufacturing.

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TruMicro Series 2000

Our precision artists in a compact format – filigree microprocessing with maximum flexibility in process parameters

Average power: 10 - 20 W
Wavelength: 515 nm, 1030 nm
Pulse duration: < 350 fs - 20 ps
Maximum pulse energy: 100 µJ at 1 MHz

The TruMicro Series 2000 is designed to work on ultra-thin layers and sensitive materials. Adjustable pulse energy and frequencies open up a wide range of applications. The series can cut ultra-thin glass and films, an can also structure and mark metals – its ultra-short pulses are highly precise and extremely gentle on the material. Machine integration is exceptionally straightforward with the optional beam guidance via a hollow-core fiber.

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TruMicro Series 6000

Our femtosecond powerhouse – for maximum throughput and high removal rates in series production

Average power: 30 - 300 W
Wavelength: 257 nm, 343 nm, 515 nm, 1030 nm
Pulse duration: < 500 fs, < 850 fs, 3 ps
Maximum pulse energy: 200 µJ at 1.5 MHz or 2 mJ at 150 kHz

The high average performance of the TruMicro Series 6000 is ideal for series production in 24/7 operation. The laser is available in many variants with different wavelengths and pulse energies up to 2 mJ, making it suitable for a broad range of applications – glass processing down into the millimetre range, engraving coated brake disks and cutting battery films, and display production with UV wavelength.

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TruMicro Series 9000

Our trailblazer – groundbreaking micromicroprocessing of large areas with 1 kW power

Average power: 1000 W
Wavelength: 1030 nm
Pulse duration: 1 ps
Maximum pulse energy: 10 mJ at 100 kHz

Ultra-short pulse processing is now also cost-effective on a large area. The globally unique high laser power of the innovative TruMicro Series 9000 scales processes such as structuring, cleaning, ablation and high-speed cutting into the square metre range. And with a high number of strokes – thanks to precise programming, multiple processing steps can be implemented flexibly with just one beam source.

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TruMicro Mark

Our versatile ultra-short pulse laser – for cold marking and microprocessing in the high-end branch

Average power: 10 - 20 W
Wavelength: 1030 nm
Peak pulse power: 22 MW
Component geometry: 2D+ and 3D

The TruMicro Mark enables ultra-precise marking, cutting and drilling without thermal effects. Ideal for black marking in medical technology, aerospace or jewellery production – with consistently high quality even on complex free form faces and sensitive materials.

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TruPulse nano

Our flexible nanosecond laser modules – for OEMs who value maximum versatility

20 - 600 W laser power
5 beam qualities from 1.3 - 5.0 M²
Pulse duration: 3 ns - 2000 ns at up to 4 MHz
Maximum pulse energy: 0.8 - 6 mJ

The TruPulse nano portfolio offers a wide range of power levels, beam qualities and pulse parameters – individually configurable to suit the application. This allows a wide variety of materials to be precisely marked, cut, engraved or precision welded using nanosecond pulses. Our TruPulse nano is designed for integrators who combine modular components flexibly to create a bespoke solution.

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TruMark fibre laser

Our versatile machines – for medium to high-power marking and surface applications

Average power: 20 - 200 W
Wavelength: ~ 1030 nm
Peak pulse power: 13 kW
Component geometry: 2D+

The TruMark fibre lasers bundle powerful laser sources for marking, structuring, cleaning, micro-cutting and welding. Whether 2D codes, deep engravings, filigree structures or high-speed processing in series – you will find the right product configuration for every application.

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