TRUMPF is pushing the boundaries of semiconductor manufacturing with efficient, innovative and sustainable EUV, laser and plasma solutions for state-of-the-art microprocessors and AI chips.
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Whether handling complex part geometries or sheets up to 25 mm thick, our all-in-one separating and sorting solution handles it effortlessly, with no programming required, even for a lot size of 1.
"We honor our customers" - this is the title of the Annual Report 2024/25. It shows why we are unique, from our machines to our architecture and social commitment, and brings together the voices of employees, customers and partners on all aspects of our brand and future.
More AI: How ElringKlinger and Schaeffler are accelerating laser welding
Schaeffler and ElringKlinger are eager to achieve high speeds in complex spot welding tasks. That is why they are venturing to use more AI in production.