Semicon Europa 2026

Less scrap, higher quality, and greater energy efficiency: The new TruPlasma RF Series G3 ensures stable and precise plasma processes in semiconductor manufacturing. Thanks to real-time monitoring and browser-based control, users can easily optimize process parameters, reduce production costs, and flexibly upgrade existing equipment.

More than three times the cutting speed while maintaining consistently high quality: The innovative laser dicing process developed by LIDROTEC together with TRUMPF combines high-precision beam shaping with a liquid flow, enabling significantly more efficient wafer separation. Users benefit from excellent cut edges, reduced post-processing, and a higher yield of defect-free chips.

Whether it’s via drilling, grooving, laser annealing, or the production of through-glass vias (TGVs), TRUMPF’s ultrashort-pulse lasers enable highly precise and efficient processes for modern advanced packaging applications and the manufacture of high-performance microchips.

Integrated chip cooling for the next generation of AI chips: Using ultrashort-pulse lasers, TRUMPF enables the industrial production of ultra-fine cooling structures directly within the chip stack. This makes it possible to cost-effectively implement innovative cooling concepts for high-performance AI processors and reliably meet the increasing demands for heat dissipation.