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TruMicro Series 5000, quick and cost-effective
TruMicro Series 5000, quick and cost-effective
Short and ultra-short pulse lasers

TruMicro Series 5000

Quick and cost-effective

    - / -
    • Overview
    • Applications
    • Technical data
    • Options
    • Software
    • Focusing optics
    • Beam guidance components
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    Micro-materials processing: maximum productivity

    The short and ultrashort pulse lasers from TRUMPF enable microprocessing with an optimal combination of quality, productivity and profitability, with no limits in terms of industrial suitability. The special pulse and power stability is achieved through the separation of pulse generation and pulse output. The patented control ensures monitoring of each individual pulse, and keeps the power and pulse energy at exactly the right level required for the application. The picosecond and femtosecond lasers of the TruMicro Series 5000 impress with their extremely short pulses and high pulse energy of up to 500 μJ. All of this together with excellent beam quality and high average powers of up to 150 W. This ensures maximum productivity in micro-materials processing. They vaporise virtually every material so quickly that a heat influence cannot be detected. They are therefore ideal for processing semiconductor materials, metals, dielectrics, plastics and glasses.

    100% tailored pulses

    The ultrafast power modulator keeps power and pulse energy at an exact level.

    All-rounders for cool tasks

    Process temperature-sensitive materials without significant heat input.

    Integration made easy

    TruMicro lasers can be integrated easily and are compatible with all common interfaces.

    Full power

    100% of the average power even in individual pulses thanks to regenerative disk technology

    Limitless industrial suitability

    The lasers, which are based on the successful TruMicro Series 5000, are designed for your everyday production tasks.

    Optical arrangement of the TruMicro Series 5000
    Highly stable for optimal quality

    Ultrashort pulse lasers from the TruMicro Series 5000 impress with extremely short pulses of less than 10 ps, as well as high pulse energies of up to 500 μJ. They vaporise virtually every material so quickly that a heat influence cannot be detected. The patented two-stage laser power control with integrated external modulator makes the laser completely stable, from pulse to pulse and across the entire power range. The peak pulse powers are up to 40 MW.

    Targeted heat input with the TruMicro Series 5000
    Zero or targeted heat input

    With laser pulses of a few pico- and femtoseconds, materials can be efficiently processed, practically without thermal or mechanical influences. To do this, the laser pulse – and therefore the duration of the energy input – must be short enough in order to avoid temperature compensation between electrons and their associated atoms. The material evaporates abruptly. The heat does not get into the surrounding material, and thermal stress fractures are avoided. This is referred to as "cold processing". For metals and many other materials, the ideal pulse duration for this is between 1 and 10 picoseconds.

    Glass cutting with TruMicro Series 5000

    Laser cutting of glass

    When laser cutting glass, the mechanical load of the material is reduced to a minimum with a TruMicro ultrashort pulse laser – there are no cracks at the edges, which means that the cut components no longer need to be smoothed down. In the display industry in particular, chemically hardened glass is used as durable protective glass and carrier substrate, and must be cut.

    High-speed laser cutting of glass

    High-speed laser cutting of glass

    Lasers currently represent the only low-impact and flexible process for cutting chemically hardened glass with a high breaking resistance. After the hardening process, the laser and the TOP Cleave cutting optics can be used to separate the glass with outstanding edge quality.

    Flexible geometries for laser cutting of glass

    Flexible geometries

    Unlike mechanical processes, with the laser you can also use the wear-free, non-contact process for flexible two- and three-dimensional geometries. The picosecond lasers of the TruMicro Series 5000 are the perfect tool here.

    Laser-cut stent with TRUMPF short-pulse lasers

    Laser-cut stent

    In the production of stents, burr-free cutting areas and edges are crucial. Picosecond lasers enable production without the need for reworking, and increase the output for the production of stents made from nitinol. The ultrashort pulse technology makes it possible to cut these bioresorbable stents made from the extremely heat-sensitive shape-memory alloy.

    High-precision structuring of sapphire

    High-precision structuring of sapphire

    Sapphire protects the high-resolution cameras in smartphones, and is used as a substrate in LED production and as cover glass in high-quality products. It is extremely durable and hard. This makes it very difficult to process sapphire efficiently without cracks using conventional methods. With a laser from the TruMicro Series 5000, you can achieve a quality that does not require reworking.

    Sapphire sample cut using picosecond laser of the TruMicro Series 5000

    Laser-cut sapphire sample

    The picosecond lasers of the TruMicro Series 5000 enable fine geometries to be cut to a high quality. The high average power of the picosecond lasers also ensures maximum productivity.

    Laser drilling a printed circuit board with a laser of the TruMicro Series 5000.

    PCB drilling made easy

    Modern printed circuit boards are designed with multiple layers and are therefore particularly compact. Holes lined with copper connect the traces between the levels. Here, the drilled holes often have a diameter of less than 100 μm. The picosecond lasers take care of this task in just one operation. The high available peak pulse powers enable the desired geometry and quality to be achieved, combined with extremely high productivity.

    Micro-drilling in the circuit board substrate

    Micro-drilling in the circuit board substrate

    In the detail view of a bore hole of the circuit board substrate, you can see the quality with which the TruMicro lasers carry out the processing. The high available peak pulse powers are a primary element for this, and also increase productivity.

    Laser holes in a ceramic plate

    Laser holes in a ceramic plate

    Good electrical insulating properties turn technical ceramics such as aluminium nitride, aluminum oxide, silicon nitride and zirconium oxide into highly sought-after materials. With the picosecond lasers you can create bore holes in these materials with the smallest diameters and in high quality.

    Laser-processed brittle-hard materials

    Laser processing of brittle-hard materials (ceramic, glass, sapphire)

    The lasers from the TruMicro Series 5000 enable high-quality processing of brittle-hard materials, such as ceramic. Drilling and cutting thin ceramic is a task for the picosecond laser. With its help, you can achieve the smallest diameters in a high quality.

    Micro-holes

    Micro-holes in thin tungsten

    Grid-shaped arrangement of micro-holes with a diameter of approx. 70 micrometres in 0.2 mm thin tungsten.

    Laser parameters                          
    Average output power 25 W 20 W 50 W 40 W 100 W 80 W 150 W 120 W 15 W 30 W 60 W 10 W 15 W
    Beam quality (M²) < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3 < 1.3
    Wavelength 1030 nm 1030 nm 1030 nm 1030 nm 1030 nm 1030 nm 1030 nm 1030 nm 515 nm 515 nm 515 nm 343 nm 343 nm
    Pulse duration < 10 ps 900 fs (tolerance -150…+100 fs) < 10 ps 900 fs (tolerance -150…+100 fs) < 10 ps 900 fs (Toleranz -150…+100fs) < 10 ps 900 fs (tolerance -150…+100 fs) < 10 ps < 10 ps < 10 ps < 10 ps < 10 ps
    Max. pulse energy 125 µJ 200 µJ 250 µJ 200 µJ 250 µJ 200 µJ 250 µJ 200 µJ 75 µJ 150 µJ 150 µJ 50 µJ 37.5 µJ
    Min. repetition rate 200 kHz 100 kHz 200 kHz 200 kHz 400 kHz 400 kHz 600 kHz 600 kHz 200 kHz 200 kHz 400 kHz 200 kHz 400 kHz
    Max. repetition rate 400 kHz 400 kHz 800 kHz 800 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 400 kHz 800 kHz 800 kHz 400 kHz 800 kHz
    Structural design                          
    Dimensions of laser head (W x H x D) 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm 680 mm x 289 mm x 1060 mm 680 mm x 289 mm x 1060 mm - - 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm 1005 mm x 319 mm x 605 mm
    Dimensions of supply unit (W x H x D) 442 mm x 1392 mm x 608 mm 442 mm x 1392 mm x 608 mm 442 mm x 1392 mm x 608 mm 442 mm x 1392 mm x 608 mm 442 mm x 1192 mm x 910 mm 442 mm x 1192 mm x 910 mm - - 442 mm x 1392 mm x 608 mm 442 mm x 1392 mm x 608 mm 442 mm x 1192 mm x 805 mm 442 mm x 1392 mm x 608 mm 442 mm x 1392 mm x 608 mm
    Installation                          
    Protection class IP54 IP54 IP54 IP54 IP54 IP54 IP54 IP54 IP54
    Ambient temperature 20 °C - 27 °C 20 °C - 27 °C 20 °C - 27 °C 20 °C - 27 °C 20 °C - 30 °C 20 °C - 30 °C - - 20 °C - 27 °C 20 °C - 27 °C 20 °C - 27 °C 20 °C - 27 °C 20 °C - 27 °C
    PDF <1MB
    Technical data sheet

    The technical data of all product versions as a download.

    Useful additional options of the TruMicro Series 5000 lasers enable you to work more efficiently and with more process reliability

    Interface variety – for simple integration

    Interfaces are key for the integration of a TruMicro laser in your machine or production line. The solid-state lasers from TRUMPF offer interfaces to all common fieldbus systems. Also available: real-time interface, parallel digital I/O, interface for process sensor systems, OPC UA software interface, analogue input board, interface for intelligent TRUMPF optics (CFO, PFO).

    Intelligent down to the workpiece

    Intelligent optics can be synchronised with your laser via a dedicated interface. This will allow you, for example, to use the CFO focusing optics or PFO scanner optics optimally for your purposes. You can program the processing optics easily using the laser control. You do not need any additional PCs or control systems.

    Remote Services

    In the event of a fault, TRUMPF service experts will remotely access your laser via a secure remote connection. In many cases the fault can be remedied directly in this way, or the configuration of the laser can be modified in a way that permits you to continue manufacturing until the spare part arrives.

    TruControl control

    TruControl

    TruControl is the quick and easy-to-use control for TRUMPF solid-state lasers. It regulates the laser power in real time in order to deliver reproducible results. TruControl manages, controls and visualises the interface configuration. You benefit from a uniform control architecture across all laser technologies. The lasers have interfaces to control intelligent TRUMPF optics, such as monitored CFO focusing optics or PFO scanner optics. You can program the processing optics easily using the laser control. With the Teleservice from TRUMPF you can also receive remote support. This will allow you to avoid service calls or be as prepared as possible and increase the availability of the laser device.

    TRUMPF offers you all the components you need for beam guidance from the laser to the workpiece. This also applies for various focusing optics which have proven themselves to be precise and reliable over many years of industrial use. The optics can be easily integrated – both in stand-alone processing stations as well as in complete production lines. The modular structure enables the optics to be continually adapted to the laser types as well as the different processing situations.

    TOP Cleave cutting optics

    The TOP Cleave focusing optics are processing optics for quickly cutting transparent materials such as glass or sapphire.

    TOP Cleave optics, high-speed laser cutting of glass
    TOP Cleave cutting optics

    High-speed laser cutting of glass

    Ultrashort laser pulses are not only ultrashort; they also achieve peak values for pulse qualities such as energy and power. To ensure that the correct pulse is applied on the workpiece despite the peak intensity, special beam guidance and formation elements are required. TRUMPF offers beam switches, deflectors, beam expanders and polarisation optics that are optimised for use with ultrashort pulse lasers.

    TruMicro deflector 90°
    TruMicro deflector 90°

    TruMicro deflectors are suitable for ultrashort laser pulses for guiding the laser beam while maintaining the pulse parameters.

    Adjustable beam splitter
    Adjustable beam splitter

    A beam splitter enables two light paths to be powered at the same time, each with half the laser power, as well as two workpieces to be processed at the same time. The mechanical setting makes it possible to adjust the divided power precisely to the uniform distribution in both beam arms.

    TruMicro beam switch with pilot light
    TruMicro beam switch

    With beam switches, the laser light can be guided in two light paths for different workpieces. The pilot laser enables simple adjustment of the beam guidance.

    Circular polarised light
    Circular polarised light

    Circular polarised light is produced from linear polarised light with the help of a quarter wave plate and makes it possible to achieve consistent processing results for applications with directional production geometries.

    This product range and information may vary depending on the country. Subject to changes to technology, equipment, price, and range of accessories. Please get in touch with your local contact person to find out whether the product is available in your country.

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    Lasers

    Whether it's cutting, welding, marking or processing surfaces: with TRUMPF, you benefit from the flexibility, versatility and cost-efficiency provided by lasers.

    Verfahrensoptimierung
    Application consultation

    You can broaden your knowledge and optimise your processes with an application consultation from TRUMPF.

    Mikrobearbeitung mit TRUMPF Produkten
    Microprocessing

    In micro-production, short-pulse lasers are used wherever controlled, highly accurate and reproducible processing is required.

    Contact

    TRUMPF Ltd.
    Fax: +44 1582 399260
    E-mail

    Downloads

    Beam sources brochure
    Beam sources brochure
    pdf - 9 MB
    Short and ultrashort pulse laser brochure
    pdf - 2 MB
    Service & contact