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Semiconductor manufacturing

No microchips without TRUMPF

TRUMPF is driving semiconductor manufacturing forward – with efficient, innovative and sustainable EUV, laser and plasma solutions for state-of-the-art microprocessors and AI chips.

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Event

Experience innovations live

Discover our event highlights full of ideas and future technologies. We look forward to talking to you in person!

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Discover the machine now!

Laser tube cutting

Make a cut with every tube

With the new TruLaser Tube 7000, you can cut your way to efficient tube production. With 9 kW laser power and significantly higher productivity.

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3D laser cutting machines

Our 3D laser cutting systems: Safe choice. Exciting performance.

Find out all about our solutions for cutting hot-formed components. With TRUMPF as your experienced partner, you are making the right choice for minimum downtime and maximum productivity.

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Bending tools

Beyond Bending: Your Entry into the 360° World of Bending

With the 360° bending world from TRUMPF, you can think beyond individual products. They combine the machine, bending tools, software and services into one smart entire system.

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Customer magazine

TRUe #23

Read the newest issue of TRUe – our magazine for sheet metal experts. Learn more about trends, future technologies, new solutions and experiences from actual users.

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Newsroom

Press release

EuroBLECH 2026: Accelerating Part Production with TRUMPF’s AI-Powered Laser Welding Cell

Thanks to artificial intelligence (AI), programming the new TruLaser Weld 3000 is significantly faster and easier

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Press release

Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips

Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers to enable the industrial production of the microstructures needed for this // Ultra-fine structures are created directly within the chip stack

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Press release

TRUMPF makes glass substrates ready for the next generation of AI chips

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.

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