Semiconductor manufacturing

A semiconductor is a material whose electrical conductivity lies between that of a conductor (e.g. copper) and an insulator (e.g. glass). Typical semiconductor materials are silicon or germanium. Conductivity can be specifically altered by doping (introduction of foreign atoms) and external factors such as temperature or light. This makes semiconductors ideal for electronic components such as transistors, diodes and integrated circuits. The semiconductor industry is growing at pace, driven by data warehouses, AI and miniaturisation. The trend is towards increasingly powerful yet smaller semiconductors. Experts call this development the nanometer race. TRUMPF's laser and plasma technologies are essential for processes such as EUV lithography, coating, laser exposure and etching. Without these technologies, production of the latest generation of chips would not be possible.

A transistor is an electronic component that serves as a switch or amplifier for electrical signals. It is the heart of modern microelectronics and forms the basis for processors, memory chips and almost all digital devices. More transistors in a chip equate to higher computing power.

A semiconductor typically goes through several hundred production steps, sometimes even more than a thousand. It takes months to manufacture. In very simple terms, the semiconductor manufacturing process can be described in ten steps:

1. The manufacturing process begins with a wafer, which is drawn from high-purity silicon and cut into thin slices.

2. The wafer is polished to create an absolutely smooth surface for the subsequent processes.

3. In lithography, a light-sensitive layer (photoresist) is applied, which later determines the structure of the circuits.

4. Extremely precise exposure methods such as EUV lithography are used to project tiny patterns onto the wafer.

5. The exposed areas are then chemically developed so that the desired structures become visible.

6. Etching processes (e.g. plasma etching) are used to remove layers of material in order to form the conductor tracks and transistors.

7. This is followed by doping processes in which foreign atoms are introduced to change the electrical properties of the silicon.

8. Several layers of metals and insulators are applied to create complex connections between the transistors.

9. After hundreds of such steps, the wafer is tested and cut into individual chips (dies) – this process is called wafer dicing.

10. Finally, the chips are packaged, tested and approved for use in devices such as smartphones, PCs and cars.

1. Information and communication technology
Semiconductors control the computing processes in computers, servers and smartphones. They are indispensable for digital communication, cloud computing and the Internet of Things (IoT).

2. Artificial Intelligence and data centres
High-performance chips enable the processing of huge amounts of data for AI applications and Big Data analytics.

3. Automotive industry
Semiconductors are essential in vehicles for driver assistance systems, e-mobility, infotainment and autonomous driving.

4. Medical technology
They are used in precise imaging, diagnostic systems and even implantable devices.

5. Industry and automation
Semiconductors power sensors, controllers and robotics in industrial manufacturing.

AI applications require enormous computing power. The more powerful the chips, the more quickly and efficiently AI models can be trained and deployed. Advances in semiconductor technology are therefore significantly driving the development of AI. TRUMPF uses technology, such as EUV, to manufacture the most powerful chips.

AI chips are specially designed processors that run complex algorithms for machine learning and artificial intelligence directly on the chip. They differ from classic processors in their ability to process large amounts of data in parallel.

AI chips are created in a highly complex manufacturing process that combines traditional semiconductor technologies with innovative packaging methods. Firstly, the actual computing cores, usually based on silicon, are manufactured using nanometer structures.

The chips must be extremely powerful and energy-efficient in order to process huge amounts of data in real time. This is why manufacturers are increasingly relying on advanced packaging. This involves combining several chips on "interposers", which serve as a connecting layer.

While silicon interposers have long been the standard, they are reaching their limits in terms of size and cost. Glass interposers provide a solution here. Glass is cheaper, can be processed into large panels, and enables complex chip packages for AI systems. To create the electrical connections between the layers, millions of tiny holes, known as Through Glass Vias (TGVs), must be drilled into the glass. TRUMPF's laser technology is used here too.

Moore's Law states that the number of transistors on a microchip doubles approximately every two years, while the cost per computation decreases. This means that the performance of chips is continuously increasing without them getting any bigger. To continue miniaturisation, technologies such as EUV lithography and new chip architectures (e.g. 3D structures) are being used. The law was formulated in 1965 by Gordon Moore, co-founder of Intel. It is not a law of nature, but an observation that reflects the pace of innovation in the industry.

1. Miniaturisation and precision
The industry is under enormous pressure to produce ever smaller structures in the nanometer range. EUV lithography and plasma generators must operate with extreme precision to create 3D structures on silicon wafers. Even the smallest deviations lead to rejects and high costs. Quality control (metrology) is becoming increasingly complex, as tolerances are in the nanometer range.

2. Energy consumption and sustainability
Energy efficiency is crucial for reducing operating costs and achieving sustainability goals. Plasma generators and laser systems must therefore operate as energy-efficiently as possible.

3. Supply chains and quality assurance
The entire supply chain must guarantee zero-defect quality. Supplier vulnerabilities can jeopardise production. TRUMPF imposes strict quality standards on its partners and suppliers.

4. Availability of production systems
Semiconductor production is heavily concentrated in Asia. Equipment suppliers must provide chip manufacturers worldwide with the highest quality of service in order to avoid downtime. This is the reason why TRUMPF is investing in regional service hubs and technology centres, for example in Taiwan.

Lithography is a key process in semiconductor manufacturing, in which structures for electronic circuits are transferred onto silicon wafers. In this process, a special coating device applies a light-sensitive layer (photoresist) to the wafer. The lithography system then exposes the desired patterns using light and develops them chemically. These structures form the basis for transistors and other components on the chip. EUV lithography is the most advanced technology in this field. It uses extremely short-wavelength light to create nanometer-sized structures. The most powerful microchips cannot be manufactured without EUV lithography. It is crucial for the implementation of Moore's Law, which states that the number of transistors doubles every two years.

A wafer is the starting point for microchip production. It consists of high-purity silicon, which is first drawn into a single crystal and then cut into thin wafers. These slices are polished to create an absolutely smooth surface. The structures of the circuits are created on the wafer through lithography, laser exposure, etching processes and doping. After hundreds of process steps, the wafer is tested and cut into individual chips ("dies").

Wafer dicing refers to the process of separating semiconductor chips from a wafer. This is a key step in the backend of the semiconductor process chain.

Mechanical sawing, stealth dicing, ablative laser dicing and plasma dicing.

Plasma etching is a process in which material is removed or structured from the wafer surface using ionized gas (plasma). This process is essential for achieving a precise chip structure.

A device that supplies high-frequency electrical energy to generate and control plasma for chip manufacturing.

Through Glass Vias (TGVs) are tiny, conductive vias in glass that enable electrical connections between different layers of a chip package. They are crucial for high-performance applications because they shorten signal paths and minimise energy losses.

Semiconductor production requires a lot of energy. Semiconductor companies can significantly reduce their carbon footprint by relying on energy-efficient technologies and circular economy; TRUMPF technology plays a key role here. Sustainability is part of TRUMPF's DNA as a family business. That is why we attach great importance to using energy and materials efficiently and sparingly in forward-looking technologies such as EUV lithography.