TRUMPF is driving semiconductor manufacturing forward – with efficient, innovative and sustainable EUV, laser and plasma solutions for state-of-the-art microprocessors and AI chips.
Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips
Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers to enable the industrial production of the microstructures needed for this // Ultra-fine structures are created directly within the chip stack
TRUMPF makes glass substrates ready for the next generation of AI chips
The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.
What is plasma - and what does it have to do with my cell phone?
Plasma is indispensable for making microchips. Learn everything you need to know about this fascinating substance and how it shapes industry and progress.