One of the things that the ILT and TRUMPF team want to take a close look at under the high-brilliance X-ray light is the welding of metal-ceramic substrates (MCS). These MCS's connect electronic components in a high-voltage environment, such as the performance electronics of an electric car. A wafer-thin layer of copper is applied to an insulating ceramic plate. The car manufacturers want to use the green laser to weld another copper component onto the MCS for contacting. A copper-to-copper connection is involved. The question is now: How can everything be optimized in the welding process? The copper plates should be as thin as possible, the process should be extremely fast, the seam should hold 100% and the ceramic must not be affected by the laser. In short: How does one find the perfect laser setting for the most productive process?