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Mikrobearbeitung mit TRUMPF Produkten

Microprocessing

For a long time, the notion of performing structuring and ablation work using solid-state lasers was practically unknown. It is only since microprocessing has been on everyone's lips that these methods are increasingly moving into the spotlight. During laser structuring and laser ablation, workpieces are processed in small and tiny dimensions.

In terms of the methods involved, structuring and ablation are closely related. Short laser pulses with very high pulse power generate such high energy densities that the material usually evaporates immediately (sublimates). This method creates only a minimal melt. Each laser pulse produces a small depression, typically measuring approx. 10 micrometres in diameter and just a few micrometres in depth.

Mikrobearbeitung in der Photovoltaikbranche

Structuring

The term 'structuring' refers to the process of generating regular geometries in a surface in order to selectively modify its technical properties. The individual elements in such structures often measure only a few micrometres.

Lackabtrag mit Lasern der TruMicro Serie 7000

Laser ablation

Ablation is mostly used in tool and mould making, and in the electronics and semi-conductor engineering sectors. In injection moulding tools, for example, lasers generate highly detailed three-dimensional depressions. These shapes are then adopted by the plastic part later on during the injection moulding phase. However, lasers can also selectively ablate thin layers, for example for trimming resistors or for marking components.

Laserbohren einer Leiterplatte mit einem Laser der TruMicro Serie 5000.

Drilling

A distinction is made between percussion, trepanning and helical drilling. During percussion drilling, the laser's focus remains fixed in one spot. With trepanning drilling, a start hole is first drilled using several laser pulses. The hole is then enlarged by moving the laser's focus in a circular motion in the hole. During helical drilling, numerous laser pulses work down to the necessary depth in a circular motion, like a spiral staircase.

Specific applications

Hochgeschwindigkeitslaserschneiden von Glas
Glass processing

Highly accurate glass cutting

Mikrobearbeitung von Keramik
Ceramics processing

Laser processing of ceramics as a brittle material

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Short and ultrashort pulse lasers

Whether it's cutting, drilling, ablation or structuring: TRUMPF's short and ultrashort pulse lasers provide a sophisticated tool for micro-processing.

Branchen, TRUMPF GmbH + Co. KG
Industry solutions

For numerous industries, TRUMPF has tailor-made solutions and specialists with precise knowledge of the specific requirements and applications.

Oberflächenberarbeitung mit TRUMPF Laser
Surface processing

Lasers are also used to increase component resistance. They help when hardening surfaces, when remelting and with coating work.

Contact

TRUMPF Ltd.
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