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Passive sputtering (PVD method) | TRUMPF

Passive sputtering (PVD method)

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PVD technology (Physical Vapour Deposition) is used to apply thin films measuring just micrometres to materials of various qualities. To do so, a block of material, consisting of the film material to be applied, is evaporated in a vacuum. This creates a gas mixture of atomic particles, which precipitate onto the substrate. In plasma-assisted PVD processes, a cathode is evaporated by being bombarded with ions. This sputter or evaporation process can take place at room temperature. It is divided into three stages: Sputtering, diffusion, and film growth.